[1]张泉.高压IGBT模块基板焊接工艺研究[J].控制与信息技术,2011,(03):5-7.[doi:10.13889/j.issn.2095-3631.2011.03.003]
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高压IGBT模块基板焊接工艺研究()
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《控制与信息技术》[ISSN:2095-3631/CN:43-1486/U]

卷:
期数:
2011年03期
页码:
5-7
栏目:
电力电子器件与应用
出版日期:
2011-06-05

文章信息/Info

Title:
Research on Baseplate Soldering Process of High-voltage IGBT Module
文章编号:
1671-8410(2011)03-0005-03
作者:
张泉
株洲南车时代电气股份有限公司
关键词:
IGBT 模块基板SnAg 焊料真空回流焊接空洞率
Keywords:
IGBT module baseplate SnAg solder vacuum reflow soldering void rate
分类号:
TN405, TG442
DOI:
10.13889/j.issn.2095-3631.2011.03.003
文献标志码:
A
摘要:
AlN 衬板与AlSiC 基板之间的焊接层是高压IGBT 模块的主要散热通道,该焊接层的空洞率对高压IGBT模块性能和长期可靠性有直接影响。文章采用SnAg 无铅焊膏和真空回流焊接技术,研究了预热温度、峰值温度、液相线上时间等工艺参数对高压IGBT 模块AlN 衬板与AlSiC 基板焊接质量,特别是对焊接层空洞率的影响。
Abstract:
The solder layer between AlN substrate and AlSiC baseplate is a main way of heat dissipation for high-voltage IGBT module. Therefore, the void rate of the solder layer has a direct impact on the performance and reliability of high-voltage IGBT module. In this paper, using the SnAg free-lead solder paste and vacuum reflow technology, it is researched the effects of preheat temperature, peak temperature and time above liquidus on the quality of the solder layer between AlN substrate and AlSiC baseplate, especially on the void rate of the solder layer.

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备注/Memo

备注/Memo:
收稿日期:2011-01 -02
作者简介:张泉(1 9 7 4 - ),男,工程师,主要从事大功率I G B T芯片和模块的研究和开发工作。
更新日期/Last Update: 2017-10-16